Three-Terminal Single Poly NMOS Non-Volatile Memory Cell With Shorter Program/Erase Times

ABSTRACT

A three terminal non-volatile memory (NVM) cell for a CMOS IC is formed by either a standard CMOS process flow or a slightly modified CMOS process flow. The NVM cell includes read and injection transistors that share a common floating gate. The floating gate includes a portion disposed over the channel region of the read transistor, a portion disposed over the channel region of the injection transistor, and a portion extending into an enlarged drain diffusion area away from the channel regions, whereby the gate-to-drain capacitance is higher than the gate-to-source capacitances. The source/drain of the injection transistor are formed using different LDD implants to achieve faster program/erase. Alternatively, an optional CHE enhancing implant is added to the source/drain of the injection transistor to enhance CHE programming. Both HV LDD and LV LDD implants are introduced together enabling LDD implant merging under the floating gate extension.

RELATED APPLICATIONS

This application is a continuation in part of U.S. patent applicationfor “Three-Terminal Single Poly NMOS Non-Volatile Memory Cell”, U.S.application Ser. No. 12/730,186, filed Mar. 23, 2010, which is acontinuation of U.S. patent application for “Three-Terminal Single PolyNMOS Non-Volatile Memory Cell”, U.S. application Ser. No. 12/398,912,filed Mar. 5, 2009 which is a continuation in part of U.S. patentapplication for “Asymmetric Single Poly NMOS Non-Volatile Memory Cell”,U.S. application Ser. No. 12/037,051, filed Feb. 25, 2008. Thisapplication also claims priority of U.S. Provisional patent applicationfor “Three Terminal NVM Cell And Memory Array”, U.S. App. Ser. No.61/115,773, filed Nov. 18, 2008.

FIELD OF THE INVENTION

The present invention relates to non-volatile memory (NVM) cells. Morespecifically, the present invention relates to NVM cell arrays that are“embedded” in (i.e., integrally formed with) complementarymetal-oxide-semiconductor (CMOS) integrated circuits (ICs), and tomethods for fabricating the NVM cells in an inexpensive manner usingstandard CMOS process flows.

BACKGROUND OF THE INVENTION

“CMOS” refers to both a particular style of digital circuitry design,and the family of processes used to implement that circuitry on IC“chips” or “die”. CMOS logic uses a combination of p-type and n-typemetal-oxide-semiconductor field-effect transistors (MOSFETs) toimplement logic gates and other circuits found in computers,telecommunication equipment, and signal processing equipment. Typicalcommercial CMOS ICs include millions (or hundreds of millions) of n-typeand p-type MOSFETs.

Most CMOS IC manufacturers (aka, “fabs”) generate standardized process“flows” for generating CMOS ICs on monocrystalline silicon wafers. EachCMOS process flow includes a series of processing steps (e.g., materialdeposition, photolithographic exposure, and etching) that are requiredto produce a desired CMOS IC product. Standard CMOS process flows aretypically developed to produce “normal” CMOS IC devices (i.e., CMOS ICdevices that comprise mainly volatile n-type and p-type MOSFETS) using aminimum number of processing steps in order to minimize overallproduction costs. Significant effort is typically expended by eachmanufacturer to make their standard CMOS process flow as time and costefficient as possible. Once a standard CMOS flow is optimized, it cantypically be used to make a large number of CMOS IC designs merely byproviding a different set of photolithography masks for each IC design,and then repeating the standard CMOS process flow using the selected setof photolithography masks.

Although most standard CMOS process flows facilitate the inclusion ofnon-MOSFET circuit components into the CMOS IC products, a problemarises when a circuit design requires a circuit component that cannot beproduced by the standard CMOS process flow. In this case, particularlywhen several additional steps are required to produce a particularnonstandard circuit component, where each step requires a correspondingadditional mask and associated, the CMOS process flow must besignificantly modified at great expense to include the additional stepsin order to produce the needed circuit component. It is thereforedesirable to develop methods for producing the non-standard circuitcomponent using the steps of the existing CMOS process flow, or usingonly a small number of additional process steps that can be included inthe standard CMOS process flow with minimal effect on the standard CMOScircuit elements.

Non-volatile memory (NVM) or “floating gate” cells represent one type ofnon-standard circuit component that is often needed in large scale CMOSICs. In contrast to volatile (aka primary storage) memory built oftypical n-type and p-type MOSFETs which require continuous power toretain stored information, NVM cells are able to retain a stored stateeven when power to an IC is turned off, thereby allowing the IC to“remember” important operating conditions and information upon restart.Several types of NVM cells have been developed that can be produced withminimal changes to a standard CMOS process flow. One NVM cell that has asmall floating gate capacitively coupled to the drain area is disclosedin U.S. Pat. No. 6,678,190. This NVM cell is a programmable read onlymemory comprising two serially connected P-type metal-oxidesemiconductor (MOS) transistors, wherein the floating gate coupling tothe source and drain is symmetric, and wherein a control gate is omittedbecause a special gate bias is not necessary in the programming mode. Aproblem with the PMOS NVM cells of U.S. Pat. No. 6,678,190 is that onlya small portion of Vd is transferred to the floating gate, so that asubsequent erase operation is practically impossible, thus limiting theapplication of corresponding cells to OTP (one-time program) memoriesonly.

What is needed is an NVM cell that is small to medium in size, exhibitshigh endurance (allows multiple cycling, i.e., program/eraseoperations), and can be produced using either a standard single-polyCMOS process flow (i.e., a CMOS process flow including only a singlepolysilicon layer), or a slightly modified single-poly CMOS process flowthat adds only one or two additional masks to a standard CMOS processflow.

SUMMARY OF THE INVENTION

The present invention is directed to medium-sized, three-terminal(two-channel) NVM (logic) cells that exhibit high endurance and areproduced using either a standard single-poly CMOS process flow (i.e., aCMOS process flow that does not require the use of masks other thanthose used to produce standard CMOS components), or using a slightlymodified standard single-poly CMOS process flow that utilizes only oneor two additional masks and processes that are consistent with thestandard CMOS process flow (i.e., that have no effect on the standardCMOS circuit components). Each NVM cell includes two NMOS transistors—aread transistor and an injection (program/erase) transistor that share acommon drain region and a common floating gate. In the three-terminalembodiments, the read transistor and injection transistor haverespective (first and second) source regions disposed adjacent to theshared drain region, and the floating gate has a first portion disposedover a first channel region located between the first source region andthe drain region, a second portion disposed over a second channel regionlocated between the second source region and the drain region, and athird (extension) portion that overlaps (i.e., extends “over”) theshared drain (diffusion) region at a location away from the first andsecond channel regions, and is coupled to the drain region such that thegate-to-drain capacitance between the floating gate and the drain regionis substantially higher than the gate-to-source capacitances between thefloating gate and either of the first and second source regions.

According to the present invention, various techniques are utilized tomodify the injection transistor of the two-channel NVM cell tofacilitate shorter program times, shorter erase times, or both shorterprogram and erase times. In a first specific embodiment, the source anddrain regions of the injection transistor) are fabricated usingdifferent low-voltage (LV) and high voltage (HV) lightly doped drain(LDD) implants (e.g., the drain region is formed using an HV-LDD implantand the source region is formed using an LV-LDD implant). This techniqueprovides short erase times, but increases the amount of time needed toprogram the NVM cells (i.e., in comparison to cells in which both theinjection source and drain are formed using LV-LDD implants).Alternatively, the opposite LDD implant pattern (e.g., the source regionis formed using an HV-LDD implant and the drain region is formed usingan LV-LDD implant) is used to provide shorter program times and longererase times. In other specific embodiments, at least one extra mask isused to provide a channel-hot-electron (CHE) enhancing implant (e.g.,boron-difluoride (BF₂)) in the drain and source regions of the injectiontransistor. In one specific embodiment the source and drain regions ofthe injection transistor are fabricated using the standard CMOS processflow, and then the CHE enhancing implant is formed simultaneously inboth the source and drain regions using an additional mask (i.e., suchthat both a first diffusion region extending from said drain region intothe second channel region and a second diffusion region extending fromsaid second source region into the second channel region include a sumof the second doping concentration and the CHE enhancing implant). Inanother specific embodiment the source and drain regions of theinjection transistor are entirely fabricated using one or moreadditional masks to diffuse both an LDD implant and the CHE enhancingimplant into the source and drain regions of the injection transistor(i.e., such that the first diffusion region extending from said drainregion into the second channel region and the second diffusion regionextending from said second source region into the second channel regioninclude a sum of the third doping concentration and the implant, wherethe third doping concentration is modified from the first dopingconcentration and the second doping concentration to further enhance CHEprogramming and/or BBT erasing operations).

The modified injection transistors formed in accordance with the variousmethods mentioned above facilitate desirable channel hot electron (CHE)or secondary channel hot electron (CHISEL) programming of thetwo-channel NVM cells of the present invention. In the first case thisis achieved by applying a positive programming voltage to the drainregion and coupling the injection transistor's (second) source region toground (while the source of reading transistor is floating), whereby thedrain voltage is transferred to the floating gate as a result of thehigh capacitive coupling, and CHE injection from the drain region intothe floating gate is induced in the region of the injection transistor.In the second embodiment (CHISEL), the programming process is enhancedby applying a negative bias to the transistor bulk. For this purpose,the whole device is placed in an isolated P-well, or positive voltage isapplied to the source of the injection transistor with the bulkconnected to ground while source to drain voltage difference is keptconstant. Erasing the floating gate involves floating the draindiffusion and the source of the read transistor and applying thepositive voltage to the injection (second) source region, therebycausing Band-to-Band Tunneling (BBT) generation of holes and theirinjection into the floating gate. Tests performed on two-channel NVMcells produced in accordance with the present invention exhibit superiorperformance (suppressed read disturb) than comparable one-channel(two-terminal) NVM cells. During cell read-out operations a read voltagelower than the required programming voltage, e.g., 1.5-2V, is applied tothe shared drain region, the injection (second) source region isdisconnected (floating), and the read (first) source region is coupleddirectly to ground, and the cell drain-source current is compared withthe reference current to test whether the cell is programmed or erased.Because the read transistor omits the source/drain enhancements utilizedin the injection transistor, CHE are not expressed in the readtransistor during the read operation, thus read-disturb effects in thememory device are strongly suppressed. Therefore, three-terminal NVMcells produced in accordance with the present invention are ideal forincorporating into low cost CMOS integrated circuits (ICs) that requirehigh endurance, high density (i.e., several kbits to 1Mbit) NVM cells.

According to one embodiment of the invention, a CMOS IC includes bothhigh voltage (HV) MOSFETs and low voltage (LV) MOSFETs and at least onethree-terminal NVM cell formed on a substrate using one of the methodsdescribed above. The HV MOSFET and the LV MOSFET are fabricated usingprocessing steps that are optimized for producing these differentdevices. For example, HV MOSFETs are produced using lower density LDD(HV-LDD) implants, thicker gate oxides (HV-OX) and wider polysilicongate lines compared with LV devices. HV transistors are optimized forthe higher (e.g., 5V or 3.3V) applied voltages. In contrast, LV MOSFETsare produced using higher density LDD (LV-LDD) implants, thinner gateoxides (LV-OX) and narrower polysilicon gate lines that are optimizedfor the lower (e.g., 1.8V) applied voltages expected on LV MOSFETsduring operation. The various process steps used to fabricate HV and LVMOSFETs are included in standard CMOS process flows. In accordance withan embodiment of the invention, these various HV and LV process stepsare utilized to entirely fabricate the three-terminal NVM cells by usingthe LV gate design rules (LV DR) to define the width of the extensionportion of the floating gate, and utilizing one or more of the LDDimplants (e.g., Phosphorous and Arsenic) to form a continuous implantregion that merges (i.e., extends entirely across) the N+ draindiffusion under the extension portion. The present inventors have foundthat superior two-channel NVM cells are produced by forming the floatinggate on the thicker HV gate oxide, utilizing the HV-NLDD in readtransistor and LV-LDD implants in the source/drain of the injectiontransistor, and generating the implant region under the extensionportion using both LV-NLDD and HV-NLDD (or HV-NLDD only) processingsteps. Alternatively, by slightly modifying the standard CMOS processflow to include one or two additional masks and utilizing processmaterials used in the standard CMOS process flow, NVM cells are producedthat exhibit both shorter program times and shorter erase times.

In accordance with another aspect of the present invention, variousdrain region and floating gate configurations are used to optimize cellfunction and minimize cell size. In one embodiment, the first (read),second (injection) portions of the floating gate are connected to thethird (drain) by fourth and fifth polysilicon portions such that aT-shaped polysilicon structure is formed. In another embodiment, thefloating gate is patterned in a C-shaped structure with both the readand injection transistors located at the same side of the drain region.In yet other embodiments, the first and second floating gate portionsare formed in a C-shaped or box-like O-shaped pattern such that twoextension portions extend from read/injection transistors disposed atopposite sides of the drain region.

In accordance with another aspect of the present invention, thethree-terminal NVM cells are arranged in arrays that facilitate celloperations while minimizing occupied chip space. In one embodiment, eachNVM cell is connected between two bit lines and one word line, andprogram/erase operations are performed by applying programming voltagesto the word line and one of the bit lines, while read operations areperformed by applying a voltage to the word line and reading the otherbit line.

In accordance with another embodiment of the present invention, afour-terminal NVM cell includes a PMOS injection transistor and an NMOSread transistor. The advantage of the described embodiment is lowprogram currents.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the presentinvention will become better understood with regard to the followingdescription, appended claims, and accompanying drawings, where:

FIG. 1 is a simplified circuit diagram showing a CMOS IC including LVand HV MOSFETs and a two-channel NMOS NVM cell according to ageneralized embodiment of the present invention;

FIGS. 2(A), 2(B) and 2(C) are simplified circuit diagrams showingconnections to the two-channel NMOS NVM cell of FIG. 1 during program,erase and read operations, respectively, according to an embodiment ofthe present invention;

FIG. 3 is a flow diagram depicting a standard CMOS flow utilized toproduce CMOS circuit of FIG. 1 according to another embodiment of thepresent invention;

FIG. 4 is simplified top plan (layout) view showing portions of a CMOSIC including an exemplary three terminal (two-channel) NMOS NVM cellaccording to a specific embodiment of the present invention;

FIG. 5 is a cross-sectional side view showing the CMOS IC taken alongsection line 4-4 of FIG. 4;

FIGS. 6(A) and 6(B) are simplified plan views showing masks utilizedduring the fabrication of the two-channel NMOS NVM cell of FIG. 4according to the process flow shown in FIG. 3;

FIGS. 7(A) and 7(B) are simplified plan views of the masks shown inFIGS. 6(A) and 6(B), respectively;

FIG. 8 is a flow diagram depicting a modified CMOS flow utilized toproduce CMOS circuit of FIG. 4 according to an alternative embodiment ofthe present invention;

FIGS. 9(A), 9(B) and 9(C) are simplified plan views showing masksutilized during the fabrication of the two-channel NMOS NVM cell of FIG.4 according to the process flow shown in FIG. 8;

FIGS. 10(A), 10(B) and 10(C) are simplified plan views of the masksshown in FIGS. 9(A), 9(B) and 9(C), respectively;

FIG. 11 is a flow diagram depicting a modified CMOS flow utilized toproduce CMOS circuit of FIG. 4 according to yet another alternativeembodiment of the present invention;

FIGS. 12(A), 12(B), 12(C), 12(D) and 12(E) are simplified plan viewsshowing masks utilized during the fabrication of the two-channel NMOSNVM cell of FIG. 4 according to the process flow shown in FIG. 11;

FIGS. 13(A), 13(B), 13(C), 13(D) and 13(E) are simplified plan views ofthe masks shown in FIGS. 12(A)-12(E), respectively;

FIG. 14 is simplified top plan (layout) view showing a three terminalNMOS NVM cell according to another specific embodiment of the presentinvention;

FIG. 15 is simplified top plan (layout) view showing a three terminalNMOS NVM cell according to yet another specific embodiment of thepresent invention;

FIG. 16 is simplified top plan (layout) view showing a three-terminalNMOS NVM cell according to yet another specific embodiment of thepresent invention;

FIGS. 17(A) and 17(B) are simplified circuit diagrams showing arrays ofthree-terminal NMOS NVM cells connected to an addressing schemeaccording to a specific embodiment of the present invention;

FIG. 18 is simplified partial plan view showing arrays of three-terminalNMOS NVM cells connected to addressing schemes according to anotherspecific embodiment of the present invention;

FIG. 19 is a simplified partial plan view showing an array ofthree-terminal (two-channel) NMOS NVM cells connected to an addressingscheme according to another specific embodiment of the presentinvention;

FIG. 20 is a simplified partial plan view showing an array ofthree-terminal NMOS NVM cells connected to an addressing schemeaccording to another specific embodiment of the present invention;

FIG. 21 is a simplified partial plan view showing an array ofthree-terminal NMOS NVM cells connected to an addressing schemeaccording to another specific embodiment of the present invention;

FIG. 22 is a graph including cell programming data generated forthree-terminal NMOS NVM cells showing the benefit of using an injectiontransistor;

FIG. 23 is a graph showing read disturb data generated forthree-terminal NMOS NVM cells of the present invention;

FIG. 24 is a simplified partial plan view showing an NVM cell accordingto another specific embodiment of the present invention;

FIG. 25 is a simplified circuit diagram showing the NVM cell of FIG. 24in additional detail; and

FIG. 26 is a simplified partial plan view showing an array including theNVM cells of FIG. 24 connected to an addressing scheme according toanother specific embodiment of the present invention.

DETAILED DESCRIPTION OF THE DRAWINGS

The present invention relates to an improvement in embedded CMOS NVMcells. The following description is presented to enable one of ordinaryskill in the art to make and use the invention as provided in thecontext of a particular application and its requirements. The terms“coupled” and “connected”, when used alone herein, are defined asfollows. The term “connected” is used to describe a direct connectionbetween two circuit elements or structures, for example, by way of aconducting diffusion or metal line formed in accordance with normalintegrated circuit fabrication techniques. In contrast, the term“coupled” is used to describe either a direct connection or an indirectconnection between two circuit elements. For example, two coupledelements may be directly connected by way of a metal line, or indirectlyconnected by way of an intervening circuit element (e.g., a capacitor,resistor, inductor, or by way of the source/drain terminals of atransistor). In contrast to “coupled” (alone), the phrases “capacitivecoupling” and “capacitively coupled” indicates the transfer of voltageby means of the capacitance between two nodes or circuit structures. Inaddition, the term “region” is defined herein to describe a volumetric(three-dimensional) area having substantially identical electricalproperties and/or doping concentrations. Various modifications to thepreferred embodiment will be apparent to those with skill in the art,and the general principles defined herein may be applied to otherembodiments. Therefore, the present invention is not intended to belimited to the particular embodiments shown and described, but is to beaccorded the widest scope consistent with the principles and novelfeatures herein disclosed.

FIG. 1 is a simplified circuit diagram showing a CMOS IC 100 includingan LV MOSFET 110, an HV MOSFET 130, and a three-terminal (two-channel)NMOS NVM cell 150 that are all fabricated on a monocrystalline silicon“chip” 101 using either a standardized CMOS process or a substantiallystandardized (slightly modified) CMOS process flow, along with othercircuit components that are omitted for brevity. HV MOSFET 130 istypically utilized to perform voltage conversion and other interfacefunctions, and is therefore designed and fabricated for high external(system) operating voltages (e.g., 3.3V or 5V), and are typicallylocated on exterior peripheral areas 103 of chip 101. In the 5V onlydesigns HV MOSFET 130 may be located in the central area of the chipwhere LV MOSFET 110 are shown. NVM cell 150 is located in an area 104that is located either in internal area 102, external area 103 or both,and serves to store control and/or data bits that are needed after powerdown.

Referring to the top left portion of FIG. 1, as is well known in theart, NMOS LV MOSFET 110 includes an N+ source region S₁₁₀ and an N+drain region D₁₁₀ separated by a p-type channel region C₁₁₀. Formed overchannel region C₁₁₀ is a polysilicon gate structure 120-1 that isseparated from an upper surface of substrate 101 by a low-voltage gateoxide layer LV-OX. NMOS LV MOSFET 110 also includes low voltage n-typeLDD regions LDD₁₁₀ having a first (relatively high) doping concentrationthat are connected to each of source region S₁₁₀ and drain region D₁₁₀and extend into channel region C₁₁₀.

Referring to the top right portion of FIG. 1, as is also well known inthe art, NMOS HV MOSFET 130 includes an N+ source region S₁₃₀ and an N+drain region D₁₃₀ separated by a p-type channel region C₁₃₀. Formed overchannel region C₁₃₀ is a polysilicon gate structure 120-3 that isseparated from an upper surface of substrate 101 by a high-voltage gateoxide layer HV-OX. Note that high-voltage gate oxide layer HV-OX istypically thicker than low-voltage oxide layer LV-OX of LV MOSFET 110.NMOS HV MOSFET 130 also includes high-voltage n-type LDD regions LDD₁₃₀having a second, relatively low doping concentration that are connectedto each of source region S₁₃₀ and drain region D₁₃₀ and extend intochannel region C₁₃₀.

The HV LDD₁₃₀ consists of a single implant only, while LDD₁₁₀ consistsof two components—N-type and P-type. The second, P-type part of the LVNLDD implant is relatively strong and deep (to influence strongerP-wells of LV devices compared with HV transistors). A typical 40-50 keVBF₂ 6-8 10¹³/cm² implant serves as a subsurface anti-punchthroughprotecting in LV transistors. In the injection channel of thetree-terminal NVM cell it forms an abrupt p-n region with enhancedelectrical field, thus facilitating the hot carrier generation)

Referring to the lower portion of FIG. 1, two-channel NVM cell 150includes a “read” (first) floating gate NMOS transistor 151 having aread (first) source region S₁₅₁, an injection (second) transistor 155having an injection (second) source region S₁₅₅, and a shared drainregion D₁₅₀ that is separated from first source region S₁₅₁ by a firstp-type channel region C₁₅₁, and separated from injection source regionS₁₅₅ by a second p-type channel region C₁₅₅. Read source region S₁₅₁,injection source region S₁₅₅ and shared drain region D₁₅₀ are diffusedinto corresponding regions of substrate 101 using either known CMOSprocessing techniques or modified techniques discussed below. Ahigh-voltage oxide layer HV-OX, which is substantially identical to thatutilized by NMOS HV MOSFET 130 (discussed above) is formed over channelregions C₁₅₁ and C₁₅₅ and over drain region under the floating gateextension 123A in FIG. 4. A polysilicon floating gate 120-5 is shared byboth read transistor 151 and injection transistor 155, and includes afirst portion 121 that is at least partially disposed over read channelregion C₁₅₁, a second portion 122 that is at least partially disposedover second channel region C₁₅₅, and a third portion 123 that is formedover drain region D₁₅₀. Third portion 123 of floating gate 120-5 isfabricated using techniques described below such that a gate-draincapacitance C_(DS) between floating gate 120-5 and drain region D₁₅₀ issubstantially (i.e., at least 4 times) higher than a first gate-sourcecapacitance C_(GS-1) between floating gate 120-5 and first source regionS₁₅₁, and is substantially (i.e., at least four times) higher than asecond gate-source capacitance C_(GS-2) between floating gate 120-5 andsecond source region S₁₅₅. In particular, as indicated in FIG. 1,floating gate 120-5 includes a first portion 121 disposed over readchannel region C₁₅₁ (i.e., such that first portion 121 is disposedadjacent to a first section DS1 of drain region D₁₅₀), a second portion122 disposed over injection channel region C₁₅₅ (i.e., such that secondportion 122 is disposed adjacent to a second section DS2 of drain regionD₁₅₀, and a third portion 123 extending over a third section DS3 ofdrain region D₁₅₀. As described in the various specific embodimentsbelow, floating gate 120-5 is an integral polysilicon structure that isetched from a single polysilicon layer (e.g., using a singlephotolithographic mask and etching step) such that, in at least onespecific embodiment, first portion 121 is connected to third portion 123either directly (i.e., third portion 123 is connected to and extendsfrom first portion 121) or connected by an optional intermediate(fourth) portion 125, and such that second portion 122 is connected tothird portion 123 either directly or by way of an optional intermediate(fifth) portion 125. As indicated by the dashed line connecting firstportion 121 with second portion 122, in another alternative embodimentthese portions may also be connected by an optional intervening sixthpolysilicon structure 126. As such, floating gate 120-5 is formed suchthat when floating gate 120-5 is programmed, portions 121, 122 and 123have the same potential (e.g., 4V), and when floating gate 120-5 iserased, portions 121, 122 and 123 also have the same potential (below˜0.5V).

Referring to the bottom portion of NVM cell 150, NVM cell 150 alsoincludes first and second LDD regions LDD₁₅₅₋₁ and LDD₁₅₅₋₂ that areformed on each side of injection channel C₁₅₅ (i.e., first LDD regionLDD₁₅₅₋₂ forms a portion of source region S₁₅₅, and second LDD regionLDD₁₅₅₋₁ forms a portion of second section DS2 of drain region D₁₅₀), athird LDD region LDD₁₅₁₋₂ that forms a portion of first section DS1 ofdrain region D₁₅₀ and extends into read channel C₁₅₁, and a fourth LDDregion LDD₁₅₁₋₁ that forms a portion of source region S₁₅₁ and extendsinto read channel C₁₅₁. In accordance with an aspect of the presentinvention, an implant region 152 is disposed under third section DS3 ofdrain region D₁₅₀, and comprises a sum of the same dopant andconcentration as LDD regions LDD₁₃₀ of NMOS HV MOSFET 130 and regionLDD₁₁₀ of NMOS LV MOSFET, correspondingly (discussed above). Inparticular, implant region 152 is formed using the dopants andconcentrations of both NMOS LV MOSFET 110 and NMOS HV MOSFET 130 (i.e.,dopant is diffused into implant region 152 during the formation of bothLDD₁₁₀ and LDD₁₃₀) in order to facilitate the desired gate-to-draincapacitance C_(DS).

Referring again to FIG. 1, in addition to the above-described transistortypes, CMOS IC 100 includes a memory address/control circuit 160 and NVMprogram/erase circuitry 170 that are utilized in the manner describedbelow to access LV MOSFET 110 and HV MOSFET 130, and used forprogramming floating gate 120-5 of NVM cell 150 by transferring apositive programming potential from drain region D₁₅₀ to floating gate120-5, and for erasing floating gate 120-5 by transferring anapproximately zero volt potential from the drain region D₁₅₀ to thefloating gate 120-5. FIGS. 2(A), 2(B) and 2(C) shown NVM cell 150 duringprogram, erase and read operations, respectively, according to aspecific embodiment. Referring to FIG. 2(A), floating gate 120-5 isprogrammed by applying a programming voltage V_(PROG) to drain regionD₁₅₀ and connecting injection source region S₁₅₅ to ground (read sourceS₁₅₁ is disconnected (floating)), which generates channel hot electronsthat enter floating gate 120-5 from drain D₁₅₀. As indicated in FIG.2(B), floating gate 120-5 is erased by applying an erase voltageV_(ERASE) to injection source S₁₅₅ (drain region D and read source S₁₅₁are disconnected (floating)), which initiates the injection ofband-to-band tunneling (BBT) holes into floating gate 120-5 frominjection source region S₁₅₅. As indicated in FIG. 2(C), read transistor151 is used during read-out operations by applying a read voltageV_(read) which is lower than the program voltage to drain region D₁₅₀and coupling source read region S₁₅₁ to ground, while the injectionsource S₁₅₅ is floating, and measuring the resulting current I_(read)flowing from drain to the “read” source (injection source region S₁₅₅ isdisconnected). Note that CHE are not expressed in read transistor 151due to the modifications discussed below because no additional implantson top of standard HV LDD implant are introduced in the read transistorin all presented embodiments, thus the read-disturb effects in NVM cell150 are strongly suppressed compared with the one-channel(two-terminals) cell. It is clear to the skilled in the art thatprogramming efficiency can be enhanced by applying bias to the body ofthe cell, which is equivalent to applying voltage to S₁₅₅ (e.g., 1-3V)while keeping the potential difference between S₁₅₅ and D₁₅₀ constant.Such an operation enhances CHISEL and allows lower programming currents.

According to an embodiment of the present invention, CMOS 100 isproduced using a standardized CMOS process flow that is depicted inrelevant part in FIG. 3. Fabrications steps that are not essential todescribe the present invention, such as those utilized to produce p-typeMOSFETs, are omitted for brevity. The CMOS process flow includes aprocess of forming P-well regions in substrate 101 (block 210) thatdefine the boundaries of LV MOSFET 110, HV MOSFET 130 and NMOS cell 150.Referring to the left and central portions of FIG. 3, gate oxide layersare then formed on the upper surface of substrate 101 using separatedprocessing steps. This gate oxide layer production includes forming arelatively thin gate oxide LV-OX (e.g., 30 Angstroms); step 220A) for LVMOSFET 110 and a relatively thick gate oxide HV-OX (e.g., 70 Angstroms;step 220B) for HV MOSFET 130. Next, a single polysilicon layer having athickness of approximately 2000 Angstroms is formed and patterned usingknown techniques (block 230). Note that LV gate structure 120-1 of LVMOSFET 110 has a first (relatively narrow) gate line width (e.g.,0.14-0.18 μm (microns)) that is defined by the design rules (DR) of thestandard CMOS process flow. In contrast, the HV gate structure 120-3 ofHV MOSFET 130 has a second (relatively wide) gate line width (e.g., 0.35μm) that is selected to facilitate high voltage operation. Following thepolysilicon etch process, two separate LDD implants are performed usingtwo masks and implant processes. LDD implants consist of combinations ofdonor and acceptor (pocket) implants. In particular, an LV-LDD implant(block 240A) is performed using a first mask to provide LDD regionsLDD₁₁₀ of LV MOSFET 110, and an HV-LDD implant (block 240B) is performedusing a second mask to provide LDD regions LDD₁₃₀ of HV MOSFET 130.Following the LV LDD and the HV LDD implant processes, sidewall spacersare formed on the polysilicon structures (block 260), and N+source/drain region diffusions (block 270) are foamed in accordance withknown techniques. Finally, first pre-metal dielectric, contacts,metallization, including interlayer dielectrics and metal vias, andpassivation are perfoLmed according to known techniques.

Referring to the right side of FIG. 3, in accordance with an aspect ofthe present invention, according to the embodiment shown in FIG. 3, NVMcell 150 (FIG. 1) is entirely fabricated utilizing the existing LV andHV process steps of the standard CMOS process flow that are utilized toform LV MOSFET 110 and HV MOSFET 130. In particular, NVM cell 150 isproduced using only the process steps of a standard CMOS process flow(i.e., no extra masks are required), which in turn facilitate theincorporation of NVM cell 150 into CMOS ICs without any additionalmanufacturing costs. As indicated on the right side of FIG. 3, sourceregions S₁₅₁ and S₁₅₅ and drain region D₁₅₀ of NVM cell 150 are formedusing the same p-well process step (block 210) as that used to form LVMOSFET 110 and HV MOSFET 130. In addition, NVM cell 150 is producedusing the same gate oxide HV-OX step (block 220C) that is used to formHV MOSFET 130. The single polysilicon layer used to form gates 120-1 and120-3 is also patterned to form NVM cell 150 (step 230), withmodifications to the floating gate shape being incorporated into thepoly mask that are described in detail below. In accordance with anaspect of the present embodiment, NVM cell 150 is then subjected to thetwo standard LDD implant steps (blocks 240C10 and 240C20), where theseLDD implant steps are characterized in that LDD (first diffusion)_regionLDD₁₅₅₋₁ is formed using one of the two LDD implant processes (i.e.,first diffusion region LDD₁₅₁₋₁ has the same doping concentration asthat formed in one of LV MOSFET 110 in block 240A or HV MOSFET 130 inblock 240B), and LDD (second diffusion) region LDD₁₅₅₋₂ is formed usingthe other LDD implant process (i.e., second diffusion region LDD₁₅₅₋₂has the same doping concentration as that formed in the other of LVMOSFET 110 in block 240A or HV MOSFET 130 in block 240B), whereby thedoping concentration of first diffusion region LDD₁₅₁₋₁ is differentfrom the doping concentration of second diffusion region LDD₁₅₅₋₂). Forexample, as shown in FIG. 3, the LV-LDD implant step utilized for LVMOSFET 110 is used to form LDD region LDD₁₅₅₋₁ in drain region DS2 andto provide a first implant dose to second diffusion region 152 (block240C20), and the HV-LDD implant step utilized for HV MOSFET 130 is usedto form LDD regions LDD₁₅₁₋₁ and LDD₁₅₁₋₂ (i.e., regions extending intoread channel C₁₅₁, where LDD₁₅₁₋₂ forms a part of drain region DS1; seeFIG. 1), to form LDD region LDD₁₅₅₋₂ (i.e., a portion of source regionS₁₅₅ extending into implant channel C₁₅₅; see FIG. 1), and to provide asecond implant dose to second diffusion region 152 (see FIG. 3; block240C10). As set forth below, by forming NVM cell 150 using the thickerHV gate oxide and utilizing both the LV-LDD and HV-LDD implant processesin the manner described above, the present invention facilitates formingimplant region 152 that extends entirely under third portion DS3 offloating gate 120-5, whereby an optimal high drain field is provided inDS2 that facilitates CHE programming. In addition, the present inventorshave found that forming the drain and source of injection transistor 155using the LV-LDD and HV-LDD implant processes, respectively, produce anNVM cell in which programming times are faster (i.e., programmingoperations take less time), but erasing times are increased (i.e., eraseis slower). In an alternative embodiment in which fast erase/slowprogramming is desired, the injection transistor LDD implants may bereversed from that shown in FIG. 3 (i.e., the LV-LDD implant used toform LDD region LDD₁₅₅₋₂ in source region S₁₅₁, and HV-LDD implant steputilized to form LDD region LDD₁₅₅₋₂ in drain region DS2; all otherdoped regions remain the same as that shown in FIG. 3). After the LDDimplant steps are completed, floating gate 120-5 is then subject to thesame sidewall spacer process (block 260), N+ source/drain diffusionprocess (block 270), metal via, and metallization processes (block 280)that are utilized in the fabrication of LV MOSFET 110 an HV MOSFET 130.

FIGS. 4 and 5 are simplified plan and cross-sectional views showing anexemplary CMOS IC 100A fabricated on substrate 101A in accordance with aspecific embodiment of the present invention. CMOS IC 100A including anLV MOSFET 110A, an HV MOSFET 130A, and a “T” shaped two-channel NMOS NVMcell 150A. Referring to the left side of FIGS. 4 and 5, LV MOSFET 110Aincludes an N+ source region S_(110A) and an N+ drain region D_(110A)separated by a p-type channel region C_(110A), a polysilicon gatestructure 120-1A formed on LV gate oxide layer LV-OX, and includesn-type LDD regions LDD_(110A) that are connected to each of sourceregion S_(110A) and drain region D_(110A) and extend into channel regionC_(110A). Referring to the right side of FIGS. 4 and 5, HV MOSFET 130Aincludes an N+ source region S_(130A) and an N+ drain region D_(130A)separated by a p-type channel region C_(130A), a polysilicon gatestructure 120-3A formed on HV gate oxide layer HV-OX, and includesn-type LDD regions LDD_(130A). Referring to the central portions ofFIGS. 4 and 5, three terminal NVM cell 150A includes a read NMOStransistor 151 having a source region S_(151A), an injection NMOStransistor 155 having a source region S_(155A), and an enlarged drainregion D_(150A) separated from source regions S_(151A) and S_(155A) bychannel regions C_(151A) and C_(155A), respectively, and a sharedpolysilicon floating gate 120-5A that is formed on a gate oxide HV-OX.Referring to FIG. 5, NVM cell 150 also includes LDD regionsLDD_(151A-1), LDD_(151A-2), LDD_(155A-1) and LDD_(155A-2) (formed usingthe HV-LDD implants and LV-LDD implants as described above withreference to blocks 240C10 and 240C20 of FIG. 3) that are connected toeach of source regions S_(151A) and S_(155A) and drain region D_(150A),respectively. In FIG. 4, the square boxes with internal “X” shapesdesignated contact structures used to provide electrical connection tothe source/drain and gate structures of CMOS IC 100A.

In accordance with an aspect of the present embodiment, as shown in FIG.4, floating gate 120-5A comprises a substantially T-shaped polysiliconstructure including a first portion 121A disposed over channel regionC_(151A), a second portion 122A disposed over channel region C_(155A),and a third portion 123A extending parallel to first portion 121A andextending over a central area of enlarged drain region D_(150A), afourth portion 124A that is connected between respective ends of firstportion 121A and third portion 123A, and a fifth portion 125A that isconnected between respective ends of second portion 122A and thirdportion 123A. Note that fourth portion 124A and fifth portion 125A aredisposed over areas located outside of the boundaries of channel regionsC_(151A) and C_(155A) and drain region D_(150A). First portion 121A hasa gate line width defined by the high voltage design rule (HV-DR) of thestandardized CMOS process flow (i.e., first portion 121A has the samewidth as gate 120-3A of HV MOSFET 130A). Second portion 122A has a widthINJ-DR (between LV-DR and HV-DR) in order to enhance the CHE programmingbut not to cause channel leakage (e.g., in the range from 0.18 um to0.35 um). Third portion 123A has a width defined by the minimum designrule (MIN-DR) width of the standardized CMOS process flow. In onespecific embodiment, using a 0.18 micron CMOS process flow, the width ofthird portion 123A is 0.14 microns. The relatively large width of firstportion 121A is required to support the read-out potentials that aregenerated between source region S_(151A) and drain region D_(150A)(across channel region C_(151A)) without read disturb. In contrast,third portion 123A is not subject to the operating constraints andpotentials of first portion 121A, and therefore is made narrower thanfirst portion 121A in order to save space and increase capacitance tothe floating gate (due to merging of NLDD implant under its narrowpolycrystalline silicon (polysilicon) structure).

In accordance with another aspect of the present embodiment, NVM cell150A includes both LV-LDD and HV-LDD implants formed during therespective LV-LDD and HV-LDD implant process steps, which areillustrated in relevant part in top and cross-sectional side views inFIGS. 6(A), 6(B), 7(A) and 7(B) as described below. Referring to FIG.6(A), the positions of source region S_(151A), drain region D_(150A),source region S_(155A), channel regions C_(151A) and C_(155A), andfloating gate 120-5A are indicated in dashed lines for reference. Asindicated in FIGS. 6(A) and 7(A), a first mask 310 used during theHV-LDD implant process (see blocks 240A and 240C10 of FIG. 3) defines afirst opening 311 ₁₅₁ that is positioned over and exposes the sourceregion S_(151A), a second opening 311 ₁₅₅ that is positioned over andexposes the source region S_(155A), and a third opening 311 ₁₅₀ that ispositioned over and exposes drain regions DS1A and DS3A, whereby HV-LDDimplant material 312 is diffused into these regions during the LDDimplant process (note that drain region DS2A is covered by mask 310,thereby preventing diffusion of material 312 in this region). Similarly,as indicated in FIGS. 6(B) and 7(B), a second mask 320 used during theLV-LDD process defines a first opening 321 ₁₅₀ that is positioned overand exposes drain regions DS2A and DS3A in order to facilitate diffusionof LV-LDD implant material 322 into drain region DS3A (implanted region152A) and drain region DS2A (note that drain region DS1A, source regionS_(151A) and source region S_(155A) are covered by mask 320, therebypreventing diffusion of LV-LDD material 322 in these regions). As shownin FIGS. 7(A) and 7(B), during the HV-LDD and LV-LDD implant processes,the mask opening 311 ₁₅₀ and 321 ₁₅₀ respectively produce both LV-LDDimplant material and HV-LDD implant material in third drain region DS3A(i.e., implanted region 152A). As such, implanted region 152A has thesum of both HV-LDD and LV-LDD doping concentrations of LDD regionsLDD_(110A) and LDD_(130A), which are shown in FIG. 5 and are producedduring the LV-LDD and HV-LDD implant processes, respectively. Thepresent inventors have found that superior three-terminal (two-channel)NVM cells are produced by forming floating gate 120-5A on the relativelythick HV gate oxide such that second gate portion 123A has the minimalwidth set by the LV-DR, using HV-LDD implants in the source regionsS_(151A) and S_(155A) and drain region DS1A, and generating implantregion 152A in drain region DS3A under third portion 123A using both theLV-LDD and HV-LDD implants. This combination of processes are believedto form implant region 152A such that it merges under (i.e., extendsentirely under) third portion 123A, as depicted in FIG. 4, wherebyimplant region 152A extends between opposing edges of N+ drain regionD_(150A) that are located below opposing side edges of third portion123A.

In accordance with another aspect of the present embodiment, NVM cell150A is programmed using channel hot electron (CHE) injection and erasedusing band-to-band tunneling (BBT) holes. During programming, a positiveprogramming voltage (e.g., 5V-6V is applied to drain region D_(150A) andinjection source region S_(155A) is connected to ground (0V), and readsource region S151A is floating, thereby causing CHE injection fromchannel drain region D₁₅₀ into the floating gate 120-5A. In oneembodiment, the programming process is enhanced by applying a body biasvoltage (e.g., from −1 to −5V to the P-well in which injectiontransistor 155 is formed). In one specific embodiment, the body biasfrom −3V to −5V voltage is applied to the isolated P-well containingchannel region C_(155A) with a delay period of 1 to 100 μS (100microseconds) after asserting the programming voltages 4.5V to drainregion D_(150A) and coupling source region S_(155A) to ground. Eraseoperations are performed by keeping the drain region D_(150A) and readsource region S151A floating and applying the positive erase voltage tosource region S_(155A), thereby causing BBT generation of holes in theregion S_(155A), their acceleration in the field of source junction andtunneling into the floating gate 120-5A.

Referring again to FIG. 1, although the embodiment described above withreference to FIGS. 3-7 provides a desirable method for producing NVMcell 100 without the need for an additional mask or process steps (i.e.,NVM cell 100 is fabricated entirely using a standard CMOS process flow),the present inventors have determined that by forming NVM cell 100 withan optional CHE enhancing implant 158 (e.g., boron-difluoride (BF₂))provided in drain diffusion region LDD₁₅₅₋₁ and source diffusion regionLDD₁₅₅₋₂ of injection transistor 155, NVM cell 100 can be produced withshorter CHE programming and BBT erase operation times. In addition, thepresent inventors have determined that optimal CHE enhancing implants158 can be produced by adding a small number of masks (e.g., one or two)and associated process steps into a standard CMOS process flow withoutdisrupting the operation of the other CMOS elements, and while utilizingthe materials used during the standard CMOS process flow. Examples ofthese alternative methods and resulting NVM cells are described belowwith reference to FIGS. 8-13.

FIG. 8 shows a modified CMOS process flow according to a firstalternative embodiment of the present invention. Similar to the processflow shown in FIG. 3 (described above), fabrications steps that are notessential to describe the present invention are omitted for brevity.FIG. 8 repeats the process portions of the standard CMOS process flow(see FIG. 3) that are associated with the fabrication of LV MOSFET 110(i.e., blocks 210, 220A, 230, 240A, 260, 270 and 280) and HV MOSFET 130(i.e., blocks 210, 220B, 230, 240B, 260, 270 and 280) for context, anddetails of these steps are understood to be essentially identical tothose described above and will therefore not be repeated here forbrevity. In addition, process portions of the standard CMOS process flow(see FIG. 3) associated with the fabrication of NVM cell 150 that areutilized in the modified CMOS process flow of FIG. 8 (e.g., blocks 210,220C, 230, 260, 270 and 280) are understood to be essentially identicalto those described above, and details of these processes will thereforealso not be repeated here for brevity.

Referring to the central right side of FIG. 8, the modified CMOS processflow of FIG. 8 is similar to the standard CMOS process flow of FIG. 3 inthat, after polysilicon patterning (block 230), portions of NVM cell 150are formed using the two standard LDD implant steps (blocks 240C11 and240C21). However, in this embodiment, the HV-LDD process is utilized toimplant HV-LDD material into the entire area of drain D₁₅₀ (i.e., ineach of drain regions DS1, DS2 and DS3) and also in both source regionsS₁₅₁ and S₁₅₅ (see block 240C11), and then the LV-LDD process isutilized to implant LV-LDD material only into drain region DS3 of drainD₁₅₀ (i.e., in implanted region 152; see block 240C21). According to thepresent embodiment, an additional mask is then utilized to form CHEenhancing implants 158 (block 250) in drain region DS2 and source regionS₁₅₅, thereby providing the enhanced injection transistor structuredescribed above.

FIGS. 9(A) to 9(C) and 10(A) to 10(C) are top and cross-sectional sideviews illustrating masks and associated Processes performed inaccordance with blocks 240C11, 240C21 and 250 of FIG. 8 according to anexemplary embodiment associated with the fabrication of NVM cell 100A(described above with reference to FIGS. 4 and 5). These figures showthe positions of source region S_(151A), drain region D_(150A), sourceregion S155A, and the floating gate for reference using dashed lines inthe manner described above with reference to FIG. 6(A).

As indicated in FIGS. 9(A) and 10(A), a first mask 330 used during theHV-LDD implant process (see blocks 240A and 240C11 of FIG. 8) defines afirst opening 331 ₁₅₁ that is positioned over and exposes the sourceregion S_(151A), and a second opening 331 ₁₅₀ that is positioned overand exposes drain regions DS1A, DS2A and DS3A, and a third opening 331₁₅₅ that is positioned over and exposes the source region S_(155A),whereby HV-LDD implant material 332 is diffused into these regionsduring the LDD implant process. Next, as indicated in FIGS. 9(B) and10(B), a second mask 340 used during the LV-LDD process defines anopening 341 ₁₅₀ that is positioned over and exposes drain region DS3A,whereby this opening facilitates diffusion of LV-LDD implant material342 into drain region DS3A (implanted region 152A; note that drainregions DS1A and DS2A and source regions S_(151A) and S_(155A) arecovered by mask 340, thereby preventing diffusion of LV-LDD material 342in these regions). Finally, as indicated in FIGS. 9(C) and 10(C), an“extra” mask 350 is used during the non-standard CHE enhancing implantprocess (see block 250 of FIG. 8), where mask 350 defines a firstopening 351 ₁₅₁ that is positioned over and exposes the source regionS_(151A), and a second opening 331 ₁₅₀ that is positioned over andexposes drain region DS3A, whereby a CHE enhancing implant material 352(e.g., BF₂ applied with an energy in the range of 20 to 140 Key and atan angle in the range of 0 to 45°) is diffused into these regions (notethat source region S_(151A) and drain regions DS1A and DS3A are coveredby mask 330, thereby preventing diffusion of CHE enhancing material 352in these regions). According to the process illustrated in FIGS. 9(A) to9(C) and 10(A) to 10(C), the LDD portion of drain region DS2A (firstdiffusion region) and the LDD portion of source region S_(155A) (seconddiffusion region) include a sum of the HV-LDD doping concentrationapplied with material 342 and CHE implant material 352, whereby theresulting injection transistor is fabricated to exhibit the enhancedprogram/erase functions mentioned above. Following the CHE enhancingimplant, the standard CMOS process flow (see FIG. 8) is resumed.

FIG. 11 shows a modified CMOS process flow according to a secondalternative embodiment of the present invention. Similar to the processflow shown in FIG. 8 (described above), fabrications steps that are notessential to describe the present invention are omitted for brevity, andprocess portions of the standard CMOS process flow are repeated forcontext, but details of these steps are understood to be essentiallyidentical to those described above and will therefore not be repeatedhere for brevity.

Referring to the central right side of FIG. 11, the modified CMOSprocess flow of FIG. 11 is similar to the standard CMOS process flow ofFIG. 3 in that, after polysilicon patterning (block 230), the readtransistor and implanted region 152 of NVM cell 150 are formed using thetwo standard LDD implant steps (blocks 240C12 and 240C22). That is, theHV-LDD process is utilized to implant HV-LDD material into only inregions DS1 and DS3 of drain D₁₅₀, and also in source region S₁₅₁ (seeblock 240C12), and then the LV-LDD process is utilized to implant LV-LDDmaterial only into drain region DS3 of drain D₁₅₀ (i.e., in implantedregion 152; see block 240C22). According to alternative variations ofthe present embodiment, either one additional mask (block 250-2) or twoadditional masks (blocks 250-21 and 250-22) are then utilized to formCHE enhancing implants 158 in drain region DS2 and source region S₁₅₅,thereby providing the enhanced injection transistor structure describedabove. These variations are explained in additional detail withreference to the example provided below.

FIGS. 12(A), 12(B), 13(A) and 13(B) are top and cross-sectional sideviews illustrating masks and associated processes performed inaccordance with blocks 240C12 and 240C22 of FIG. 11 according to anexemplary embodiment associated with the fabrication of NVM cell 100A(described above with reference to FIGS. 4 and 5). These figures showthe positions of source region S_(151A), drain region D_(150A), sourceregion S155A, and the floating gate for reference using dashed lines inthe manner described above with reference to FIG. 6(A). As indicated inFIGS. 12(A) and 13(A), a first mask 360 used during the HV-LDD implantprocess (see blocks 240A and 240C12 of FIG. 11) defines a first opening361 ₁₅₁ that is positioned over and exposes the source region S_(151A),and a second opening 361 ₁₅₀ that is positioned over and exposes drainregions DS1A and DS3A, whereby HV-LDD implant material 362 is diffusedinto these regions during the HV-LDD implant process. Similarly, asindicated in FIGS. 12(B) and 13(B), a second mask 370 used during theLV-LDD process defines a first opening 371 ₁₅₀ that is positioned overand exposes drain region DS3 to facilitate diffusion of LV-LDD implantmaterial 372 into drain region DS3A (implanted region 152A).

FIGS. 12(C) and 13(C) illustrate the single-mask variation of thepresent embodiment associated with block 250-2 of FIG. 11. In thisvariation, an “extra” mask 380-1 is formed with a first opening 381-1₁₅₀ that is positioned over and exposes drain region DS3A, and a secondopening 381-1 ₁₅₅ that is positioned over and exposes the source regionS_(155A). As indicated in FIG. 13(C), “extra” mask 380-1 is during aspecial implant process involving diffusion of material 382-1 (e.g., acombination (sum) of the N-type part of the LV-LDD implant performed inblock 240A and a CHE enhancing implant (e.g., BF₂ applied with an energyin the range of 20 to 140 KeV and at an angle in the range of 0 to 45°)that are sequentially applied through openings 381-1 ₁₅₀ and 381-1 ₁₅₅into region DS3A and source region S_(155A). According to the variationillustrated in FIGS. 12(C) and 13(C), the LDD portion of drain regionDS2A (first diffusion region) and the LDD portion of source regionS_(155A) (second diffusion region) include a sum of the selected (third)LDD doping concentration and the CHE implant material, whereby theinjection transistor 155A exhibits the enhanced program/erase functionsmentioned above.

FIGS. 12(D), 12(E), 13(D) and 13(E) illustrate the two-mask variation ofthe present embodiment associated with block 250-21 and 250-22 of FIG.11. In this variation, as shown in FIGS. 12(D) and 13(D), a first“extra” mask 380-21 is formed with an opening 381-21 ₁₅₀ that ispositioned over and exposes drain region DS3A (source region S_(155A)remains masked), and a first material 382-21 (e.g., a combination of theN-type part of the LV-LDD implant performed in block 240A and a CHEenhancing implant (e.g., BF₂ applied with an energy in the range of 20to 140 KeV and at an angle in the range of 0 to 45°) that aresequentially applied through opening 381-21 ₁₅₀ into region DS3A. First“extra” mask 380-21 is then removed, and then, as shown in FIGS. 12(E)and 13(E), a second “extra” mask 380-22 is formed with an opening 381-22₁₅₅ that is positioned over and exposes source region S_(155A) (drainregion DS3A remains masked), and a second material 382-21 (e.g., acombination of the N-type part of the LV-LDD implant performed in block240A and a CHE enhancing implant (e.g., BF₂ applied with an energy inthe range of 20 to 140 KeV and at an angle in the range of 0 to 45°)that are sequentially applied through opening 381-22 ₁₅₅ into sourceregion S_(155A). According to the variation illustrated in FIGS. 12(D/E)and 13(D/E), the LDD portion of drain region DS2A (first diffusionregion) and the LDD portion of source region S_(155A) (second diffusionregion) include a sum of two selected (third and fourth) LDD dopingconcentrations and the CHE implant material, whereby the injectiontransistor 155A exhibits both enhanced program and programmed erasefunctions.

The present inventors have determined through experimental observationthat forming the CHE enhancing implants utilized in the variations setforth above by implanting BF₂ using an implant energy that is increasedfrom the 40 keV (which is normally utilized in standard CMOS processflow LDD implants) to 80 keV significantly reduced programming times andprovides several other advantages such as reduced programming current(i.e., higher hot electron generation efficiency). First, CHEprogramming time was found to decrease from 10 ms (in the absence of theCHE enhancing implant) to approximately 2 ms for the same programmingvoltage, thereby providing substantially shorter programming times. Inaddition, the maximum allowable programming voltage was found toincrease from approximately 6.5V to approximately 7V. Further, becauseno remarkable changes in programming current were detected, and becausethe cell was able to operate at the higher (approximately 7V)programming voltage, the CHE enhancing implant facilitates reducing thechannel length L_(INJ) from 0.3 μm to 0.24 μm to achieve additionalimprovement in programming time. Finally, by utilizing an implant energyof 80 keV and using a channel length L_(INJ)=0.24 μm, programming timewas further reduced to about 1 ms.

Forming CHE enhancing implants by implanting the BF₂ at 80 keV was alsofound to provide improved erase times as well. The inventors observedthat the erase times were decreased by about one order of magnitude forerase voltages of 6.5V. The Source junction avalanche occurs at lowervoltage in case of “80 keV” flavor (˜7V instead ˜8.5V). Erase byavalanche mechanism is fast, but is considered to be more harmful thanBTB. The recommended maximal erase voltage was found to be 7V.

The various cell fabrication methods set forth above are not limited toNVM cell 100A (shown in FIGS. 4 and 5), and those skilled in the artwill recognize that the methods and diffusion patterns set forth abovemay be incorporated into NVM cells having other gate arrangements, suchas those described below with reference to FIGS. 14-16.

FIG. 14 is simplified top plan view showing a three-terminal “C” or“horseshoe” shaped NMOS NVM cell 150B according to another specificembodiment of the present invention. NVM cell 150B is formed as part ofa CMOS IC, similar to that described above, which includes both LVMOSFETs and HV MOSFETs, which are omitted from the discussion below forbrevity. Similar to NVM cell 150A (discussed above), NVM cell 150Bincludes a read NMOS transistor 151B having a source region S_(151B), aninjection NMOS transistor 155B having a source region S_(155B), and anenlarged drain region D_(150B) separated by a channel region C_(151B)from source region S_(151B) and by a channel region C_(155B) from sourceregion S_(155B), and a polysilicon floating gate 120-5B. Floating gate120-5B is similar to floating gate 120-5A (discussed above) in that itis formed on an HV oxide (not shown), and includes a first portion 121Bdisposed over channel region C_(151B) and adjacent to a first sectionDS1B of drain region D_(150B), a second portion 122B disposed overchannel region C_(155B) and adjacent to a second section DS2B of drainregion D_(150B), and third portions 123B disposed over an enlarged thirdsection DS3B of drain region D_(150B). Note that floating gate 120-5Bdiffers from floating gate 120-5A (discussed above) in that two portions123B extend from first portion 121B and second portion 122B over drainregion D150B, respectively, and first and second portions 121B and 122Bare directly connected by a (sixth) portion 126B. NVM cell 150B issubjected to the LDD implant processes in the manner described above tofacilitate the formation of drain implant 152B and optional CHEenhancing implant regions 158B similar to those described above withreference to FIGS. 8-13.

FIG. 15 is a simplified top plan view showing a three-terminal(two-channel) NMOS NVM cell 150C according to another specificembodiment of the present invention. Similar to NVM cell 150B (discussedabove), NVM cell 150C includes read NMOS transistor 151C having a sourceregion S_(151C), an injection transistor 155C having a source regionS_(155C), and an enlarged drain region D_(150C) separated by a channelregions C_(151C) and C_(155C), and a “C” shaped polysilicon floatinggate 120-5C formed on an HV oxide (not shown). However in thisembodiment, read transistor source region S_(152C) and injectiontransistor source region S_(155C) are disposed on opposite sides ofdrain region D_(150C) such that channel regions C_(151C) and C_(155C)are separated by drain region D_(150C), and such that an intervening(sixth) portion 126C of floating gate 120-5C extends over a portion ofdrain region D_(150C) between first portion 121C and second portion122C. NVM cell 150C is subjected to the LDD implant processes in themanner described above to facilitate the formation of drain implant 152Cand optional CHE enhancing implant regions 158C similar to thosedescribed above with reference to FIGS. 8-13.

NVM cells 150B and 150C (shown in FIGS. 14 and 15) are used, forexample, when there is no confidence in implant merging under thecoupling extension polysilicon. This may be the case in specialprocesses used, e.g., for fabrication of Power Management IC.Corresponding products are often “5 V only” to save the masks intendedfor 1.8 v logics in the core CMOS process flow. In this case, only ˜100A-140 A GOX is used (both in the NVM area and in the logic part of themicrocircuit).

FIG. 16 is simplified top plan view showing a three-terminal(two-channel) NMOS NVM cell 150D according to yet another specificembodiment of the present invention. NVM cell 150D is similar to NVMcell 150C (discussed above) in that NVM cell 150D includes a read NMOStransistor 151D having a source region S_(151D), and an injectiontransistor 155D having a source S_(155D) that are disposed on oppositesides of an enlarged drain region D_(150D), and a floating gate 120-5Dthat includes first and second portions 121D and 122D that are connectedby an extension portion 126D. However, NVM cell 150D differs from NVMcell 150C in that (third) portion 123 extends entirely across drainregion D_(150D), such that a substantially “O” (ring-like or circular)shape is formed by polysilicon gate structure 120-5D. The ring-likestructure of polysilicon gate 120-5D make NVM cell 150D the most compactimplementation of read-disturb-free NVM cell based on the proposedprinciple. NVM cell 150D is subjected to the LDD implant processes inthe manner described above to facilitate the formation of drain implant152D and optional CHE enhancing implant regions 158D similar to thosedescribed above with reference to FIGS. 8-13.

FIGS. 17(A) and 17(B) are simplified circuit diagrams showing variousarrays of three-terminal NMOS NVM cells, which are constructed in themanner described above with reference to the specific embodiments ofFIGS. 3-16, as arranged and connected to associated addressing schemes.These addressing schemes facilitate cell operations while minimizingoccupied chip space, and are optimized in the manner described below tofacilitate programming and erasing operations.

FIG. 17(A) is a simplified circuit diagram showing a portion of a CMOSIC 100E including three-terminal NMOS NVM cells 150-x,y arranged in anarray including three rows and two columns, where “x,y” represents therow number and column number, respectively. The array includes wordlines W1 and W2 and bit lines B11, B12, B21, B22, B31 and B32 that areconnected to associated NVM cells 150-x,y, and are also connected toaddressing/control circuitry (e.g., circuits 160 and 170; see FIG. 1) inorder to perform program/erase and read operations on the NVM cells. NVMcells 150-x,y are implemented using any of the specific three-terminalNVM cells described herein. Word lines W1 and W2 are disposed parallelto the columns of three-terminal NVM cells, and each word line isconnected to the drain region of each NVM cell of an associated column.For example, word line W1 is connected to drain region of NVM cell150-1,1, and also to the drain regions of NVM cell 150-2,1 and 150-3,1.Conversely, bit lines B11 to B32 are disposed parallel to the rows ofNVM cells, and each bit line is connected to a read source region orinjection source region of each NVM cell of an associated row. Forexample, bit line B11 is connected to the read source regions of NVMcells 150-1,1 and 150-1,2, and bit line B12 is connected to theinjection source regions of NVM cells 150-1,1 and 150-1,2. With thisarrangement, the program/erase/read circuitry (not shown) addresses aselected NVM cell (e.g., NVM cell 150-1,1) during program/eraseoperations by selectively applying predetermined programming voltages tothe word line (e.g., W1) and the bit line (e.g., B12) that is associatedwith the selected NVM cell, and during read operations by applying apredetermined read voltage to the word line (e.g., W1), by applying 0voltage to the source (e.g., B11) that is associated with the selectedNVM cell, and measuring the drain-source current. Note that theremaining word lines and bit lines are disconnected (floating) duringthe program/erase and read operations directed to the selected NVM cell.

FIG. 17(B) is a simplified circuit diagram showing a portion of a CMOSIC 100F according to an alternative embodiment, where word lines W41,W42 and W43 are disposed parallel to the rows of three-terminal NVMcells, and each word line is connected to the drain region of each NVMcell of an associated row. For example, word line W41 is connected todrain region of NVM cell 150-1,1, and also to the drain region of NVMcell 150-1,2. Bit lines B41 to B44 are disposed parallel to the columnsof NVM cells, and each bit line is connected to a read source region orinjection source region of each NVM cell of an associated column.

FIG. 18 is a partial simplified plan view showing an IC circuits 100Gincluding NVM cells 150A-1,1 to 150A-4,2 arranged in four rows and twocolumns. NVM cell 150A-1,1 is consistent with NVM cell 150A, describedabove with reference to FIGS. 4 and 5. Consistent with the arrangementdescribed above with reference to FIG. 17(A), each column of NVM cellsis coupled to a common word line (e.g., NVM cells 150A-1,1, 150A-2,1,150A-3,1 and 150A-4,1 are connected to word line W51, and NVM cells150A-1,2, 150A-2,2, 150A-3,2 and 150A-4,2 are connected to word lineW52), and each NVM cells in each row of the array of CMOS circuit 100Gshare two adjacent bit lines (e.g., the read transistor source regionsof cells 150A-1,3 and 150A-1,2 are connected to bit line B51, and theinjection transistor source regions of cells 150A-1,1 and 150A-1,2 areconnected to bit line B52). Bit lines B53 and B54 are similarlyconnected to the sources of the second row, bit lines B55 and B56 aresimilarly connected to the sources of the third row, and bit lines B57and B58 are similarly connected to the sources of the fourth row. Tominimize space, according to the embodiment shown in FIG. 18, drainregions of each adjacent pair of NVM cells in each column are combined(connected together) and connected to the associated word line by acommon connection point. For example, cells 150A-1,1 and 150A-2,1 areinverted and share a common drain D_(150G-1) that is connected to wordline W51. For similar reasons, at least two cells in each column share acommon drain diffusion that is formed in accordance with the descriptionprovided above. For example, NVM cells 150A-1,1 and 150A-2,1 shareelongated drain diffusion 152G, which also extends under cells 150A-3,1and 150A-4,1.

FIG. 19 shows a portion of a CMOS IC 100H including an array of NVMcells arranged according to another embodiment, wherein each NVM cell isconsistent with the NVM cell 150B described above with reference to FIG.14, and the drain regions of NVM cells in each row are connectedtogether and to a shared word line, and source regions of NVM cells ineach column are connected to shared bit lines in the manner describedabove with reference to FIG. 17(B). For example, the drain regions ofNVM cells 150B-1,1 and 150B-1,2 are connected to word line W61, wherethe source regions of NVM cell 150B-1,1 are respectively connected tobit lines B61 and B62 and the source regions of NVM cell 150B-1,2 isconnected to bit lines B63 and B64. In contrast to the arrangementdescribed above with reference to FIG. 18, all cells in each row sharedrain implant regions. For example, drain D_(150H-1) and a drain implant152H are shared by adjacent row cells 150B-1,2 and 150B-2,2. Similardiffusions are shared by cells 150B-2,1, 150B-2,2, 150C-3,1, 150C-3,2,150C-4,1 and 150C-4,2 of the remaining rows.

FIG. 20 shows a portion of a CMOS IC 100J including an array of NVMcells arranged according to another embodiment, wherein each NVM cell isconsistent with the NVM cell 150C described above with reference to FIG.15, and the drain regions of NVM cells in each row are connectedtogether and to a shared word line, and source regions of NVM cells ineach column are connected to shared bit lines in the manner describedabove with reference to FIG. 17(B). For example, the drain regions ofNVM cells 150C-1,1 and 150C-1,2 are connected to word line W71, wherethe source regions of NVM cell 150C-1,1 are respectively connected tobit lines B71 and B72 and the source regions of NVM cell 150C-1,2 isconnected to bit lines B73 and B74. All cells in each row share a commondrain and a drain implant region. For example, adjacent row cells150C-1,1 and 150C-1,2 share a common drain D_(150J-1), and a shareddrain implant 152J. Similar diffusions are shared by cells 150C-2,1 and150C-2,2 of the second row, and cells 150C-3,1 and 150C-3,2 of the thirdrow.

In yet another embodiment shown in FIG. 21, a CMOS IC 100K includes anarray of NVM cells wherein each NVM cell is consistent with the NVM cell150D described above with reference to FIG. 16, and the drain regions ofNVM cells in each row are connected together and to a shared word line,and source regions of NVM cells in each column are connected to sharedbit lines in the manner described above with reference to FIG. 17(B).For example, the drain regions of NVM cells 150D-1,1 and 150D-1,2 areconnected to word line W81, where the source regions of NVM cell150D-1,1 are respectively connected to bit lines B81 and B82 and thesource regions of NVM cell 150D-1,2 is connected to bit lines B83 andB84. All cells in each row share a common pocket implant region, a drainand a drain implant region. For example, adjacent row cells 150D-1,1 and150D-1,2 share a common drain D_(150K-1) and a shared drain implant152K. Similar diffusions are shared by cells 150D-2,1 and 150D-2,2 ofthe second row, and cells 150D-3,1 and 150D-3,2 of the third row.

FIGS. 22 and 23 include graphs showing experimentally generated data onprototype two-channel NVM cells (on silicon) at the single cell level.

FIG. 22 is a graph showing cell programming test data generated forthree-terminal NMOS NVM cells, and indicates that when programming isperformed by way of the injection transistor of the cells, programmingtime is reduced and accumulated charge is increased in comparison toprogramming by way of the read transistor. It is seen that with 4.5V atdrain, only several milliseconds are necessary to obtain a ˜2V memorywindow by programming through the W=0.35 um (min DR) injectiontransistor. Several seconds are needed to program the NVM cell to thesame level through the reading transistor with the same Poly CD.

FIG. 23 is a graph showing “Time-to-failure” Takeda plot (lifetime vs.reciprocal drain voltage) data for Two-Terminal (single channel) andThree-Terminal (two-channel) cells. The failure is defined as a ˜400 mVFG potential increase. The graph demonstrates the extrapolated timenecessary for the 400 mV FG potential increase at different drainvoltages in the read-out operation. For two-terminal cells, a 10 daycontinuous read at a typical 2V voltage results in failure. In theproposed Three-Terminal NVM cell the read disturb is not an issue (3000years of continuous operation till the read disturb results in failure).

Although the present invention has been described with respect tocertain specific embodiments, it will be clear to those skilled in theart that the inventive features of the present invention are applicableto other embodiments as well, all of which are intended to fall withinthe scope of the present invention. For example, in alternativeembodiments a number of different programming and erasing methods may beused, e.g., erasing with ultraviolet (UV) light, programming using anavalanche breakdown in the drain region, etc. In addition, a pocketimplant or another special drain engineering scheme may be performed inthe transistor source/drain regions to enhance lateral electrical fieldsand thus increase the efficiency of programming and erase. An additionalPoly topology over the drain connected Active area may be used toincrease coupling to the floating gate.

Moreover, although the present invention is described with reference toNMOS NVM cells, those skilled in the art will recognize that theconcepts described above may be utilized to produce NVM cells havingsimilar characteristics but employing PMOS transistors placed inN-wells, e.g., a PMOS NVM injection transistor programmed using hot holeinduced electron injection, NMOS readout transistor and arrayorganization without select transistors. An NVM cell 150L utilizing aPMOS transistor for programming and an NMOS transistor for readout anderase is shown in FIGS. 24 and 25, and a corresponding arrayincorporating NVM cell 150L is shown in FIG. 26.

Referring to FIGS. 24 and 25, memory cell 150L consists of injectionchannel PMOS transistor 155L and a readout/erase NMOS transistor 151Lthat share a “Y” shaped floating gate 120-5L. Readout NMOS transistor151L includes a source region S_(151L) and a drain region n that areseparated by a first portion 121L of floating gate 120-5L. Injectiontransistor 155L is formed in an N-Well 159L and includes a source regionS_(155L) and a drain region D_(155L) that are separated by a secondportion 122L, where drain region D_(155L) includes two sectionsD_(155L-1) and D_(155L-2) that are bisected by a narrow third portion123L of gate 120-5L, which acts as an extension for increasing the draincoupling. A channel C_(155L) of injection transistor 155L is implantedwith LV PLDD implant. The area of extension (i.e., the region includingsections D_(155L-1) and D_(155L-2)) is implanted with both HV PLDD andLV PLDD to stimulate implant merging under the undersized Poly of theextension with the width of 0.14 um-0.2 um in 0.18 um Design Rules.Channel region C_(151L) of readout transistor 151L is implanted with LVNLDD implant (to enhance BBT of holes for erase).

Programming of cell 150L is performed by channel hot holes inducedelectron injection (CHHEI). For this purpose, voltage of 5-6V is appliedto N-well 158L, and drain region D_(155L) of injection transistor 155Lis connected to ground. Source region S_(155L) is at the same potentialas that of N-Well 158L, and the source and drain of readout transistor151L are coupled to ground. Due to capacitive coupling, a voltage of −1Vto −2V with respect to N-Well 159L is transferred to floating gate120-5L. Injection transistor 155L is thus slightly open (Vt of PMOS isof the order of −0.8V), and there is a flow of holes in channelC_(155L). The holes create electron-hole pairs in drain region D_(155L)and secondary electrons are injected into floating gate 120-5L (thevertical field in the drain region facilitates injection). To erase thecell, zero voltage is applied to N-well 158L, while negative voltage(from 0 to −6V) is applied to P+ diffusions of the injection transistor(i.e., drain region D_(155L) and source region S_(155L)) and positivevoltage is applied to drain D151L of the read-out/erase NMOS transistor151L. Due to strong capacitive coupling, negative potential istransferred to floating gate 120-5L. This enhances the BBT of holes andtheir injection into floating gate 120-5L in drain region D_(151L) ofreadout transistor 151L. The advantage of the described embodiment islow program currents. This is similar to CHISEL case described for otherembodiments, but the currents are lower (in the range 1 to 10 uA/cellfor the same programming times). Vertical field assists electroninjection thus enhancing its efficiency.

In the read-out operation all terminals of injection transistor 151L aremaintained at 2-2.5 V, while drain region D_(151L) of read-outtransistor 151L is maintained at ˜1V (source S_(151L) is coupled toground). This ensures absence of the read disturb (low drain voltages inread and longer channel C_(151L), e.g. L=0.5-1 um, thus no channel hotelectron effects are pronounced though drain field is enhanced to ensureefficient erase (in addition to low Vd in read)). The price for lowerprogramming currents and absence of read disturb is up to 25% increaseof the cell area compared with previous embodiments (due to “N-Well toS/D P+ spacing” DR). The embodiment allows similar to the previous casescross-point array organization (shown in FIG. 26). The drains of thememory cells are connected in two groups. A memory cell 150L forprogramming is selected by choosing an “Injection Source” column lineSC1, SC2 or SC3 and an “Injection drain” row line SR1 or SR2. The sameprinciple is used in the read-out and erase. The adjacent sources arebound and connected to ground during read and left floating duringerase. Drains are selected out of the two groups.

In all discussed embodiments except those associated with FIGS. 24-26,the source terminal of the read transistor can be connected to the drainof injection transistor during programming. This increases the draincapacitive coupling ratio and results in twice faster programming and upto 0.7V increase of the programming window.

1. A complimentary metal-oxide-silicon (CMOS) integrated circuit (IC) comprising: a substrate; and a multi-terminal non-volatile memory (NVM) cell including: a first source region and a second source region, each including a first dopant diffused into the substrate such that the first source region is electrically isolated from the second source region; a drain region including a second dopant diffused into the substrate and disposed such that the drain region is separated from the first source region by a first channel region and separated from the second source region by a second channel region; and a polycrystalline silicon (polysilicon) floating gate including a first portion that is at least partially disposed over the first channel region, a second portion that is at least partially disposed over the second channel region, and a third portion that is at least partially disposed over the drain region; wherein the floating gate, the first and second source regions and the drain region are formed such that a gate-drain capacitance between said floating gate and said drain region is substantially higher than both a first gate-source capacitance between said floating gate and said first source region, and a second gate-source capacitance between said floating gate and said second source region, and wherein a first diffusion region extending from said drain region into the second channel region has a first doping concentration and a second diffusion region extending from said second source region into the second channel region includes a second doping concentration, the second doping concentration being different from the first doping concentration.
 2. CMOS IC of claim 1, wherein the first doping concentration of the first diffusion region is greater than the second doping concentration of the second diffusion region.
 3. CMOS IC of claim 1, wherein the first doping concentration of the first diffusion region is less than the second doping concentration of the second diffusion region.
 4. The CMOS IC of claim 1, wherein the floating gate comprises: an elongated first portion disposed over the first channel region such that the first portion is disposed adjacent to a first section of the drain region, an elongated second portion disposed over the second channel region such that the second portion is disposed adjacent to said first diffusion region, and at least one elongated third portion extending over a third section of the drain region, the third section being spaced from the first section and the first diffusion region.
 5. The CMOS IC of claim 4, wherein the floating gate further comprises a fourth portion connected between the elongated first portion and the elongated third portion and a fifth portion connected between the elongated second portion and the elongated third portion such that the first, second, third, fourth and fifth portions comprise one of a substantially T-shaped polysilicon structure.
 6. The CMOS IC of claim 4, wherein the floating gate further comprises a sixth portion connected between the elongated first portion and the elongated second portion, and the at least one elongated third portion extends from at least one of said first and second portions such that the first, second, third, and sixth portions comprise one of a substantially C-shaped polysilicon structure, a substantially O-shaped polysilicon structure and a substantially U-shaped polysilicon structure.
 7. The CMOS IC of claim 4, further comprising: a low voltage (LV) MOSFET including a first polysilicon gate having predefined first width that is formed on a first gate oxide having a first oxide thickness, and first lightly doped drain (LDD) regions having said first doping concentration; and a high voltage (HV) MOSFET including a second polysilicon gate having predefined second width that is formed on a second gate oxide, the second gate oxide having a second oxide thickness that is greater than the first oxide thickness, the HV MOSFET also including second LDD regions having said second doping concentration, wherein said floating gate of said multi-terminal NVM cell is formed on a third gate oxide that has the second oxide thickness, and wherein said multi-terminal NVM cell further comprises an implanted region disposed below the third section of the floating gate, said implanted region having a third doping concentration including a sum of said first doping concentration and said second doping concentration.
 8. The CMOS IC of claim 7, wherein said implanted region extends entirely under said third section of said floating gate such that said implanted region extends between opposing edges of said drain region located below opposing side edges of said third portion.
 9. The CMOS IC of claim 1, further comprising means for generating channel hot electrons (CHE) in the drain region, and means for generating band-to-band tunneling (BBT) holes in the second source region.
 10. A complimentary metal-oxide-silicon (CMOS) integrated circuit (IC) comprising: a substrate; and a multi-terminal non-volatile memory (NVM) cell including: a first source region and a second source region, each including a first dopant diffused into the substrate such that the first source region is electrically isolated from the second source region; a drain region including a second dopant diffused into the substrate and disposed such that the drain region is separated from the first source region by a first channel region and separated from the second source region by a second channel region; and a polycrystalline silicon (polysilicon) floating gate including a first portion that is at least partially disposed over the first channel region, a second portion that is at least partially disposed over the second channel region, and a third portion that is at least partially disposed over the drain region; wherein the floating gate, the first and second source regions and the drain region are foamed such that a gate-drain capacitance between said floating gate and said drain region is substantially higher than both a first gate-source capacitance between said floating gate and said first source region, and a second gate-source capacitance between said floating gate and said second source region, and wherein said drain region and said second source region further includes an implant comprising means for enhancing channel hot electrons in the second channel region during a programming operation.
 11. The CMOS IC of claim 10, wherein said implant comprises a P-type implant.
 12. The CMOS IC of claim 10, further comprising: a low voltage (LV) MOSFET including a first polysilicon gate having predefined first width that is formed on a first gate oxide having a first oxide thickness, and first lightly doped drain (LDD) regions having a first doping concentration; and a high voltage (HV) MOSFET including a second polysilicon gate having predefined second width that is formed on a second gate oxide, the second gate oxide having a second oxide thickness that is greater than the first oxide thickness, the HV MOSFET also including second LDD regions having a second doping concentration, wherein both a first diffusion region extending from said drain region into the second channel region and a second diffusion region extending from said second source region into the second channel region include a sum of the second doping concentration and the implant.
 13. The CMOS IC of claim 10, further comprising: a low voltage (LV) MOSFET including a first polysilicon gate having predefined first width that is formed on a first gate oxide having a first oxide thickness, and first lightly doped drain (LDD) regions having a first doping concentration; and a high voltage (HV) MOSFET including a second polysilicon gate having predefined second width that is formed on a second gate oxide, the second gate oxide having a second oxide thickness that is greater than the first oxide thickness, the HV MOSFET also including second LDD regions having a second doping concentration, wherein both a first diffusion region extending from said drain region into the second channel region and a second diffusion region extending from said second source region into the second channel region include a sum of a third doping concentration and the implant, the third doping concentration being different from the first doping concentration and the second doping concentration.
 14. The CMOS IC of claim 10, wherein the floating gate comprises: an elongated first portion disposed over the first channel region such that the first portion is disposed adjacent to a first section of the drain region, an elongated second portion disposed over the second channel region such that the second portion is disposed adjacent to said first section of the drain region, and at least one elongated third portion extending over a third section of the drain region, the third section being spaced from the first section and the second section.
 15. The CMOS IC of claim 14, wherein the floating gate further comprises a fourth portion connected between the elongated first portion and the elongated third portion and a fifth portion connected between the elongated second portion and the elongated third portion such that the first, second, third, fourth and fifth portions comprise one of a substantially T-shaped polysilicon structure.
 16. The CMOS IC of claim 14, wherein the floating gate further comprises a sixth portion connected between the elongated first portion and the elongated second portion, and at least one elongated third portion extends from at least one of said first and second portions such that the first, second, third, and sixth portions comprise one of a substantially C-shaped polysilicon structure, a substantially O-shaped polysilicon structure and a substantially U-shaped polysilicon structure.
 17. The CMOS IC of claim 14, further comprising: a low voltage (LV) MOSFET including a first polysilicon gate having predefined first width that is formed on a first gate oxide having a first oxide thickness, and first lightly doped drain (LDD) regions having a first doping concentration; and a high voltage (HV) MOSFET including a second polysilicon gate having predefined second width that is formed on a second gate oxide, the second gate oxide having a second oxide thickness that is greater than the first oxide thickness, the HV MOSFET also including second LDD regions having a second doping concentration, wherein said floating gate of said multi-terminal NVM cell is formed on a third gate oxide that has the second oxide thickness, and wherein said multi-terminal NVM cell further comprises an implanted region disposed below the third section of the floating gate, said implanted region having a third doping concentration including a sum of said first doping concentration and said second doping concentration.
 18. The CMOS IC of claim 17, wherein said implanted region extends entirely under said third section of said floating gate such that said implanted region extends between opposing edges of said drain region located below opposing side edges of said third portion.
 19. The CMOS IC of claim 17, further comprising means for generating channel hot electrons (CHE) in the drain region, and means for generating band-to-band tunneling (BBT) holes in the second source region. 